The 3R Principle Promotes Packaging Reduction, Friendly Environment and Benefit Upgrade
With the expansion of TSMC’s production capacity, the demand for raw materials continues to grow. In order to improve the efficiency of packaging materials, TSMC’s Material Supply Chain Management Division cooperates with Incoming Material Quality and Reliability Department and Corporate Analytical Laboratories to check the packaging types of different raw material suppliers by using The 3R principle (Reduce, Reuse, and Recycle) for CMP polish pad packing boxes, memory packaging bags, silicon wafer transport box sealing films, and wafer box packaging bags. There are four kinds of packaging materials for bags, and TSMC conducts material and specification evaluation with suppliers, improves packaging methods, and actively implements resource sustainability actions to achieve the goal of being friendly to the environment.
TSMC’s Raw Material Packaging Reduction Action
Continuing to Expand the Scope of Reduction and Building a Green and Low-carbon Supply Chain
With the practical principles of “minimizing waste, maximizing resource recycling, and optimizing vendor management”, TSMC will continue to explore opportunities for reducing the amount of different raw materials packaging, targeting the original single-use target packaging, diamond plate packaging and chemical drums are evaluated and verified to improve their reuse value. TSMC will continue to update “Supplier Material Packaging White Paper Regulations” in TSMC Supplier Sustainability Academy to expand the efficiency of energy and resource use and create a green and low-carbon supply chain and implement a business model that is responsible for the environment and society.