Built on 7nm technology with planned five-year manufacturing availability, and equipped with 6, 8, 12 or 16 cores and 24 lanes of PCIe® Gen4 connectivity, Ryzen Embedded 5000 Series processors are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers. Ryzen Embedded 5000 Series processors include robust reliability, availability and serviceability (RAS) features, including an ECC-supported memory subsystem. With a thermal design power (TDP) profile ranging from 65W to 105W, Ryzen Embedded 5000 processors enable the reduction of overall system cooling footprint for space-constrained and cost-sensitive applications.
“AMD’s success in the embedded market is built on offering differentiated and scalable offerings that address a wide range of applications with different power, performance and environmental requirements,” said Kevin Krewell, principal analyst at TIRIAS Research. “The AMD Ryzen Embedded 5000 strikes an optimal balance of power and performance for applications ranging from small-form factor embedded systems to storage, security, and networking systems, suiting the broadest range of customers and use cases.”