India Government may soon approve Micron Technology’s proposal of setting up of an assembly, testing, marking and packaging (ATMP) facility in the country which involves an investment of about $1 billion.
The US-based semiconductor company will utilise the facility to process some of its own wafers, manufactured across the globe.
“Yes, we are close to approving the proposal,” a top government official told a news source, confirming that the planned investment figure was indeed around $1 billion.
The $30.8 billion Micron is one of the world’s largest players in memory and storage technologies, with 11 manufacturing sites spread across the US, Japan, Malaysia, Singapore, Taiwan and China.
Headed by Sanjay Mehrotra, who is of Indian origin and studied at BITS Pilani, Micron has been scouting around the globe for more than a year for a place to set up a semiconductor packaging facility.
The $10 billion semiconductor scheme of Indian government offers financial incentives to set up fab plants, ATMPs, outsourced semiconductor assembly and test (OSAT) units, and chip design facilities.
OSATs provide packaging and testing services for multiple customers; ATMPs are captive packaging and testing centres for a company.