Setting up of a manufacturing facility to build a portfolio of intelligent products

Setting up of a manufacturing facility to build a portfolio of intelligent products

The Government of Andhra Pradesh (GoAP) is delighted to announce that, GoAP has signed a Memorandum of Understanding (MoU) with M/s Flextronics Technologies (India) Pvt. Ltd., the Indian subsidiary of Flex, the Sketch-to-Scale® solutions provider that designs and builds Intelligent Products for a Connected World with over 200,000 employees in 30 countries around the world. The MoU is for the setting up of a manufacturing facility in the state of Andhra Pradesh for a range of intelligent products. Under the vision and leadership of the Hon’ble Chief Minister Shri Chandrababu Naidu Garu, and tireless stewardship of the Hon’ble Minister of IT, Shri Nara Lokesh Garu, the state of Andhra Pradesh has emerged as a frontrunner in attracting investments in the IT and Electronics sector.

dasthis auspicious occasion, the Hon’ble Minister of IT, Shri Nara Lokesh Garu said “The state of Andhra Pradesh since 2014, has strived hard to provide best-in-class incentives to boost investments in the IT & Electronics sector. Policies and an ecosystem have been put in place to promote the growth of the electronics, information and technology sector. These best-of-breed practices have been successful in convincing Flex, one of the world’s largest electronic players to believe in the Andhra Pradesh story. Flex will set up a greenfield manufacturing facility in the state to build a diverse range of intelligent products and generate thousands of jobs while building a strong supplier network. We are very confident that this association between GoAP and Flex will provide the required impetus for the rapid growth of the electronics sector in the state and will go a long way towards increasing the overall GDP of the state. With this, I warmly welcome Flex to Andhra Pradesh and assure them of our full co-operation and commitment towards the setting up of this manufacturing facility.”

Mr. Francois Barbier, President of Global Operations and Components at Flex also added “Flex is committed to providing Sketch-to-Scale® solutions for intelligent products to complement India’s rapidly growing electronics industry and would like to thank the Government of Andhra Pradesh for their support.” To provide a fillip to the growth of the electronics, information and technology sector, the state of Andhra Pradesh has focused largely on the creation of a conducive environment by formulating and implementing a vigorous policy framework and the introduction and implementation of simplified procedural requirements for setting up operations in the State. With an aim to offer substantial support to electronic manufacturers through a comprehensive incentive package, GoAP unveiled the Andhra Pradesh Electronics Policy 2014-2020 in September 2016. The state is also building a strong ecosystem for electronics systems design manufacturing (ESDM) companies, through the development of Electronics Manufacturing Clusters (EMCs) in Tirupati. The GoAP firmly believes that with the groundwork in place to boost the Electronics sector in the state, the signing of the MoU with Flex will undoubtedly encourage many more ESDM companies to seriously consider Andhra Pradesh as a premier investment destination.